Open AccessThe Preparation and Characterization of Cu/AA6061 multi-layer Composte produced by Accumulated Roll Bonding
Author(s) -
Quang Duc Pham,
Peng Hao
Publication year - 2020
Publication title -
iop conference series. materials science and engineering
Language(s) - English
Resource type - Journals
eISSN - 1757-899X
pISSN - 1757-8981
DOI - 10.1088/1757-899x/758/1/012099
Subject(s) - microstructure , accumulative roll bonding , materials science , characterization (materials science) , layer (electronics) , scanning electron microscope , composite number , ultimate tensile strength , composite material , optical microscope , metal , metallic bonding , metallurgy , nanotechnology
The present study focuses on the preparation and characterization of Cu/AA6061 multi-layer composite materials produced by accumulated roll bonding (ARB). The bonding between metallic layers and the microstructure of samples was characterized by optical and scanning electron microscopy and tensile testing which were used to characterize the mechanical properties. After four ARB cycles, the interface only displays a little bit, showing that the good contact between layers were formed and the mechanical properties were improved. The both materials have a fine microstructure with grain sizes decreased with increasing cycles of ARB.