Open AccessEffect of Polyethylene Glycol and Chloride Ions on Local Electrochemical Deposition of Micro Copper Columns
Author(s) -
Qixin Qing,
Fuliang Wang,
Yufei Xiao,
Lin Wang
Publication year - 2020
Publication title -
iop conference series. materials science and engineering
Language(s) - English
Resource type - Journals
eISSN - 1757-899X
pISSN - 1757-8981
DOI - 10.1088/1757-899x/746/1/012002
Subject(s) - polyethylene glycol , copper , electrolyte , electrochemistry , peg ratio , anode , chloride , materials science , deposition (geology) , chemical engineering , microstructure , copper plating , electrode , inorganic chemistry , chemistry , metallurgy , layer (electronics) , composite material , electroplating , paleontology , finance , sediment , economics , engineering , biology
Local electrochemical deposition (LECD) is a very promising three-dimensional (3D) metal microstructure fabrication method. To fabricate smaller and better micro structures, a 20 μm micro anode and suppressor were used to reduce the diameter of a micro copper column and improve its surface morphology. Micro copper columns were deposited with a copper sulfate electrolyte, with or without polyethylene glycol (PEG) and chloride (Cl − ) ions. The morphology and size of all deposited columns were analyzed at the same voltage, and the deposition mechanisms with PEG and Cl − were discussed. Results indicated that the 20 μm micro anode formed a micro copper column of diameter 30-40 μm, and the use of PEG and Cl − further decreased the diameter to 28.1 μm.