Open AccessAutomatic systems supporting research on modern materials and industrial bonding technologies
Author(s) -
R. Wojciechowski,
Marcin Bąkała,
A. Rylski
Publication year - 2020
Publication title -
iop conference series. materials science and engineering
Language(s) - English
Resource type - Journals
eISSN - 1757-899X
pISSN - 1757-8981
DOI - 10.1088/1757-899x/743/1/012046
Subject(s) - wetting , brazing , soldering , materials science , surface tension , sessile drop technique , mechanical engineering , contact angle , wilhelmy plate , adhesive bonding , process (computing) , fabrication , surface mount technology , process engineering , adhesive , nanotechnology , composite material , computer science , engineering , layer (electronics) , medicine , alternative medicine , alloy , quantum mechanics , pathology , operating system , physics
Industrial bonding technologies, including soldering and brazing, operate on solid-liquid phase boundaries. Commonly applied in many areas of industry (such as electronics, metallurgy or aviation), these bonding processes rely on the wetting of joining surfaces using a liquid bonding material. Understanding the wetting process and quantitative description of its parameters enables the design of new materials and joining technologies, as well as the optimization of existing methods. From the primary interfacial impact parameters, i.e. the contact angle and surface tension, the dynamics of the wetting process can be determined, including adhesive tension. This article investigates two independent measurement systems for wetting parameters in industrial brazing technologies: the sessile drop method and the Wilhelmy plate method. Both methods can be applied effectively in research on wetting processes. The measurement systems are compared in an example study.