Open AccessSimulation of the process of conduction of thermal energy transfer through the multilayer wall of the apparatus
Author(s) -
A. I. Tuishchev,
Tatyana P. Tretyakova,
Tamara Sergeevna Ozerova,
Yu P. Kulakova
Publication year - 2020
Publication title -
iop conference series. materials science and engineering
Language(s) - English
Resource type - Journals
eISSN - 1757-899X
pISSN - 1757-8981
DOI - 10.1088/1757-899x/734/1/012054
Subject(s) - thermal conduction , thermal conductivity , materials science , heat transfer , heat flux , heat transfer coefficient , thermal , mechanics , process (computing) , thermodynamics , thermal transmittance , composite material , physics , computer science , operating system
We consider a multilayer wall of the apparatus, consisting of dissimilar materials, having heat loading during heat transfer in the form of conduction (thermal conductivity). Using the basic law of thermal conductivity, mathematical expressions are derived that makes it possible to calculate the basic indicators of thermal conductivity for various multilayer walls consisting of different materials. As a demonstration of the application of the above approach, an example of calculating the equivalent coefficient of thermal conductivity and specific heat flux of a printed circuit board is given.