Open AccessNumerical Study of Enhanced Heat Transfer of MicroChannel Heat Sink with Nanofluids
Author(s) -
HuiJuan Yan,
Jialin Yang,
Wenqi Zhang
Publication year - 2020
Publication title -
iop conference series. materials science and engineering
Language(s) - English
Resource type - Journals
eISSN - 1757-899X
pISSN - 1757-8981
DOI - 10.1088/1757-899x/721/1/012052
Subject(s) - nanofluid , heat sink , microchannel , materials science , heat transfer , mechanics , reynolds number , heat transfer coefficient , micro heat exchanger , thermodynamics , laminar flow , heat transfer enhancement , physics , turbulence , nanotechnology
The electronic devices on the circuit board of the navigation device have the defects of high power and difficulty in heat dissipation, thereby restricting their performance. In view of the above defects, this paper proposes a miniature water-cooled radiator with a trapezoidal cross-section spoiler arranged at equal intervals. The numerical simulation of the three-dimensional laminar flow and heat transfer is carried out to study the performance of the micro water-cooled heat sink. The effects of Reynolds numbers and the types of nanofluids on the heat transfer performance of microchannel heat sink are also investigated. The results show that when the Reynolds number ranges from 100 to 500, the existence of the spoiler column makes the heat dissipation effect of the microchannel heat sink significantly improved, and the friction coefficient decreases with the increment of the Reynolds number. With the increasing of the volume fraction in the nano-particles, the heat transfer performance of microchannel heat sink is also improved. The heat transfer performance of SiC nanofluids is better than that of TiO2 nanofluids under the same flow rate.