Open AccessResearch and Design of Integrated System of Headphone Amplifier Based on Bluetooth Technology
Author(s) -
Hong Wang,
Lina Wang,
Xuehao Zhang
Publication year - 2020
Publication title -
iop conference series. materials science and engineering
Language(s) - English
Resource type - Journals
eISSN - 1757-899X
pISSN - 1757-8981
DOI - 10.1088/1757-899x/719/1/012081
Subject(s) - bluetooth , amplifier , audio power amplifier , computer science , headphones , interface (matter) , electrical engineering , embedded system , engineering , wireless , telecommunications , cmos , bubble , maximum bubble pressure method , parallel computing
Traditional earphones and speakers need to use audio cables to connect mobile devices and sounding units when using audio files of mobile devices such as mobile phones as audio input sources. This paper proposes a solution to this problem. This paper studies and designs a power headphone amplifier integrated system based on Bluetooth technology with STM32F407 as the main control core. The system uses CSR8670 Bluetooth audio SoC chip to realize Bluetooth audio transmission, uses TPA6112 headphone audio amplifier to realize amp function, uses HT8696 class D power amplifier to realize speaker power amplifier function, uses 3.2 inch resistive touch screen to realize human-computer interaction function, and the system introduces STemWin graphics library Implement human-machine UI interface. The system is more practical in the independent output of the amp and the speaker power amplifier circuit, the control method is more humanized, and the human-machine experience is better, which plays a driving role for the popularization of the smart home.