Open AccessInvestigation on Passivation Behavior of Sn- 0.7Cu Solder in Different Polarizing Conditions
Author(s) -
Wai Kuan Ho,
Ahmad Azmin Mohamad,
Muhammad Firdaus Mohd Nazeri
Publication year - 2019
Publication title -
iop conference series. materials science and engineering
Language(s) - English
Resource type - Journals
eISSN - 1757-899X
pISSN - 1757-8981
DOI - 10.1088/1757-899x/701/1/012059
Subject(s) - materials science , corrosion , soldering , passivation , dielectric spectroscopy , oxide , metallurgy , polarization (electrochemistry) , tin , tin oxide , alloy , layer (electronics) , electrochemistry , composite material , electrode , chemistry
Corrosion behaviour of Sn-0.7Cu solder alloy was evaluated by conducting potentiodynamic polarization and electrochemical impedance spectroscopy (EIS) techniques. The solder was polarized under the scan rate of 1.0 mV/s and with the scan range from -2 to 1 V SCE . EIS test was performed at the frequency of 10000 Hz to 0.1 Hz. The oxide layer was found on the surface of solder by post-corrosion characterization. XRD results indicate that the main corrosion products formed on the solder after both corrosion tests were tin oxide such as SnO and SnO2. Porous rod-like structure of corrosion product was observed under morphology analysis of Sn-0.7Cu solder. The corrosion product was represented as tin oxide which matched with the result of XRD.