Open AccessMechanical properties of Sn based lead free solder under different temperature
Author(s) -
Norliza Ismail,
Maria Abu Bakar,
Azman Jalar,
Muhammad Amer Hariths Jasmin
Publication year - 2019
Publication title -
iop conference series. materials science and engineering
Language(s) - English
Resource type - Journals
eISSN - 1757-899X
pISSN - 1757-8981
DOI - 10.1088/1757-899x/701/1/012051
Subject(s) - materials science , elongation , soldering , ultimate tensile strength , composite material , tensile testing , yield (engineering) , stress (linguistics) , softening , strain (injury) , metallurgy , medicine , linguistics , philosophy
In this study, effect of different temperature condition was investigated towards Sn-3.0Ag-0.5Cu (SAC305) solder wire. Tensile test with 0.1 mms −1 strain rate was performed at room temperature (25°C), 60°C, 120°C and 150°C chamber condition. Mechanical properties of SAC305 solder wire were evaluated from stress-strain curves which focused on yield stress, ultimate tensile stress (UTS) and elongation. From the stress-strain curves, there are exhibit the dynamic softening behavior for investigated solder wire. The higher temperature applied during the tensile test, induced the reduction of yield stress and UTS properties. However, elongation properties varied with the temperature condition. Highest percentage of elongation have been indicated at temperature 120°C. Therefore, different temperature conditions applied during tensile test have significant effect to the evaluated mechanical properties of SAC305 solder wire.