Open AccessEnhanced thermal and microstructure properties of Sn-1.0Ag-0.7Cu based lead-free solder with Titanium Oxide addition
Author(s) -
Rita Mohd Said,
Norainiza Saud,
Nashrul Fazli Mohd Nasir,
Mohd Arif Anuar Mohd Salleh,
Mohd Nazree Derman,
Mohd Izrul Izwan Ramli
Publication year - 2019
Publication title -
iop conference series. materials science and engineering
Language(s) - English
Resource type - Journals
eISSN - 1757-899X
pISSN - 1757-8981
DOI - 10.1088/1757-899x/701/1/012046
Subject(s) - materials science , microstructure , intermetallic , soldering , metallurgy , alloy , titanium alloy , oxide , powder metallurgy , titanium , composite number , composite material
This paper presented the effects on thermal and microstructure properties of Sn–1.0Ag–0.7Cu (SAC107) lead-free solder alloy with the addition of titanium oxide (TiO 2 ) particles. The SAC107 solders were reinforced with 0.25, 0.5, 0.75 and 1.0 weight percentage (wt.%) of titanium oxide (TiO 2 ) particles to produce SAC107+TiO 2 solder alloy composite. The solder alloy was prepared by microwave–assisted powder metallurgy route. Based on the results, it showed that the addition of TiO 2 particles influenced the properties of the solder alloy composite by refining the intermetallic compound (IMC) at the bulk microstructure area and slightly decreasing the melting temperature.