Open AccessMolecular dynamics simulation of the nano- reinforced lead-free solder at different reflow soldering process temperature
Author(s) -
Intan Norshalina Sahrudin,
Mohd Sharizal Abdul Aziz,
M. Z. Abdullah,
Mohd Arif Anuar Mohd Salleh
Publication year - 2019
Publication title -
iop conference series. materials science and engineering
Language(s) - English
Resource type - Journals
eISSN - 1757-899X
pISSN - 1757-8981
DOI - 10.1088/1757-899x/701/1/012014
Subject(s) - soldering , reflow soldering , materials science , molecular dynamics , process (computing) , nanoparticle , nano , lead (geology) , atmospheric temperature range , metallurgy , composite material , nanotechnology , computer science , chemistry , thermodynamics , computational chemistry , physics , geomorphology , geology , operating system
Temperature plays an important role in the reflow soldering process. Reflow soldering process which involving four basic stages including preheating, soaking, reflow and cooling require a specific range of temperature at each stage and the highest temperature is the reflow stage. In this study, the movement of the reinforced nanoparticles in the lead-free solder at three different stage temperatures which are 30°C,150°C and 250°C will be shown via Large-scale Atomic/Molecular Massively Parallel Simulator (LAMMPS) software. The simulation model able to show the movement of nanoparticles in the solder at three different reflow soldering process stages. The most vigorous movement of nanoparticles is shown at the temperature of 250°C while the least vigorous movement is shown at room temperature of solder which is at 30°C.