Open AccessTin (Sn) whisker growth from electroplated Sn finished
Author(s) -
Aimi Noorliyana Hashim,
Mohd Arif Anuar Mohd Salleh,
Noor Zaimah Mohd Mokhtar,
Shahida Idris
Publication year - 2019
Publication title -
iop conference series. materials science and engineering
Language(s) - English
Resource type - Journals
eISSN - 1757-899X
pISSN - 1757-8981
DOI - 10.1088/1757-899x/701/1/012005
Subject(s) - whisker , electroplating , materials science , solderability , tin , metallurgy , microelectronics , monocrystalline whisker , scanning electron microscope , electronics , plating (geology) , soldering , composite material , nanotechnology , electrical engineering , engineering , layer (electronics) , geophysics , geology
Electroplated tin (Sn)Limeited finishes are widely used in the electronics industry due to their excellent solderability, electrical conductivity and corrosion resistance. However, since prohibiting the use of lead (Pb) in electronics, the issue of tin (Sn) whisker has become one of the most imperative issues that need to be resolved. Moreover, with the increasing demand for electronics miniaturization, Sn whisker growth is a severe threat to the reliability of microelectronic device. This paper investigates the effect of electroplating current density (10, 30 and 50 mA/cm 2 ) on whisker growth at room temperature. A simple micro- indentation test was used to accelerate continuously the growth of Sn whisker at room temperature storage for 24 h. Morphology analysis of Sn whisker growth was done using scanning electron microscope (SEM) and image-J Software. Axial length of the Sn whisker was calculated by using JEDEC Standards (JESD22-A121A).