Open AccessStirring Effect on Surface Morphology, Structure, and Electrochemical Behavior of Electrodeposited Nickel Film on Copper Substrates
Author(s) -
Ferry Budhi Susetyo,
Ahmad Faridh,
Bambang Soegijono
Publication year - 2019
Publication title -
iop conference series. materials science and engineering
Language(s) - English
Resource type - Journals
eISSN - 1757-899X
pISSN - 1757-8981
DOI - 10.1088/1757-899x/694/1/012040
Subject(s) - materials science , nickel , copper , scanning electron microscope , electrochemistry , corrosion , metallurgy , cyclic voltammetry , morphology (biology) , polarization (electrochemistry) , chemical engineering , deposition (geology) , composite material , chemistry , electrode , biology , engineering , genetics , paleontology , sediment
Nickel as engineering material has good corrosion resistance properties. Nickel has been deposited on copper surface by electrochemical deposition with various stirring speed. Objective on this research are to observe the effect of stirring on morphology, structure and electrochemical behavior. Electrodeposited nickel film on copper substrates was conducted with various stirring speeds (0 rpm, 75 rpm, and 150 rpm). Surface morphology was observed with Field Emission Scanning Electron Microscope (FE-SEM), structure was identified with X-ray diffraction (XRD), and electrochemical behavior was investigated by potentiodynamic polarization and cyclic voltammetry. Stirring speed effect clearly on the surface morphology, structure and electrochemical behavior. Corrosion potential and corrosion current are changes while the stirring speed is increase.