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Coupling Analysis of Multi-Physical Field of High-Speed Motorized Spindle Based on Fractal Contact Theory
Author(s) -
Shufei Xue,
Jingyuan Wang,
Congbin Yang,
Zhifeng Liu
Publication year - 2019
Publication title -
iop conference series. materials science and engineering
Language(s) - English
Resource type - Journals
eISSN - 1757-899X
pISSN - 1757-8981
DOI - 10.1088/1757-899x/692/1/012036
Subject(s) - thermal contact conductance , finite element method , materials science , thermal , coupling (piping) , fractal , fractal dimension , thermal resistance , contact resistance , mechanics , joint (building) , contact area , thermal contact , mechanical engineering , composite material , structural engineering , engineering , layer (electronics) , physics , thermodynamics , mathematics , mathematical analysis
In order to improve the modeling accuracy of the motorized spindle, a comprehensive thermal contact resistance (TCR) modeling method was proposed. The fractal theory was introduced to calculate the joint thermal contact resistance. The W-M function and the M-B fractal model were established to characterize the microscopic contour of the rough surface. The bulk thermal resistance, constrained thermal resistance, micro-gap thermal resistance and overall thermal contact resistance of the rough surface of different materials were discussed. The finite element method(FEM)was used to establish the multi-physics coupling analysis model of the motorized spindle, adding the theoretical calculation of thermal contact resistance in the joint surface of the motorized spindle. The temperature rise and deformation variation of the motorized spindle were simulated under the condition of thermal contact resistance. The simulation results demonstrate the influence of thermal contact resistance on the temperature and thermal deformation of the motorized spindle. The results show that when the thermal resistance of the high-speed motorized spindle is considered, the temperature rises and the deformation increases, and the accuracy of the model is more accurate, which is closer to the actual processing.

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