Open AccessWarpage analysis and optimization of thin-walled injection molding parts based on numerical simulation and orthogonal experiment
Author(s) -
Yanfang Chen,
Jie Zhu
Publication year - 2019
Publication title -
iop conference series. materials science and engineering
Language(s) - English
Resource type - Journals
eISSN - 1757-899X
pISSN - 1757-8981
DOI - 10.1088/1757-899x/688/3/033027
Subject(s) - mold , materials science , molding (decorative) , composite material , process (computing) , mechanical engineering , computer simulation , engineering drawing , engineering , computer science , simulation , operating system
With the warpage of a mobile phone case as the index, a numerical model for injection molding was established by CAE software. The process parameters of 5 factors including injection time, mold temperature, melt temperature, packing time and packing pressure were analyzed by orthogonal experiment, the effect of injection process parameters on warpage was studied and the minimum combination of process parameters was obtained. The simulation results show that the warpage was reduced by 6.98% after optimization, and higher quality plastic parts were obtained, which has important guiding significance for the production practice of thin-wall parts.