Open AccessWall panels for agricultural and industrial buildings
Author(s) -
N. I. Gorin,
S. A. Ryabchun,
О. Г. Кулик
Publication year - 2019
Publication title -
iop conference series. materials science and engineering
Language(s) - English
Resource type - Journals
eISSN - 1757-899X
pISSN - 1757-8981
DOI - 10.1088/1757-899x/687/3/033002
Subject(s) - frame (networking) , structural engineering , thermal insulation , layer (electronics) , embedding , connection (principal bundle) , lead frame , computer science , materials science , engineering , composite material , telecommunications , artificial intelligence , semiconductor device
The authors develop a new construction, manufacturing technology and method of calculating three-layer wall panels with heat-insulating packages embedded in a contour frame of lightweight concrete for agricultural and industrial buildings. The proposed technical solution gives the wall panels a number of significant distinguishing properties: the outer and inner plates of the heat-insulating package of the panel along the contour are embedded in the monolithic reinforced concrete frame; a layer of insulation is embedded in the contour frame, which ensures a decrease in its thermal conductivity; embedding of plates and insulation in the contour frame minimizes the labor capacity of the elements connection; placing a layer of insulation between two pre-made plates.