Open AccessStudy on Size Error Compensation of Connecting Bracket Based on Fused Deposition Modeling
Author(s) -
Shibo Li,
Tingting Liu,
Xingzhi Xiao,
Wu Hu,
Wenhe Liao
Publication year - 2019
Publication title -
iop conference series. materials science and engineering
Language(s) - English
Resource type - Journals
eISSN - 1757-899X
pISSN - 1757-8981
DOI - 10.1088/1757-899x/686/1/012013
Subject(s) - compensation (psychology) , fused deposition modeling , bracket , embedding , 3d printing , dimension (graph theory) , column (typography) , process (computing) , computer science , printing press , mechanical engineering , engineering , mathematics , connection (principal bundle) , artificial intelligence , psychology , psychoanalysis , pure mathematics , operating system
In the integrated additive manufacturing of electronic products, the connecting bracket is a typical fixed structure for embedding electronic components such as PCBs, sensors, batteries, etc. The dimensional accuracy of column spacing affects the stability of embedded components directly. In this paper, aiming at the printing error of connecting bracket column spacing during the Fused Deposition Modeling (FDM), the printing error compensation is studied via the single factor experiments. The impact of design size on printing error is analyzed, and the printing error compensation model is established. Based on the FDM printing process of the connecting bracket, the main influencing factors of the printing error are analyzed. The results show that the column spacing printing error is the result of the combination of the dimension error of column printing, the dimension error of base printing and the motion error of the machine. Finally, based on the error compensation model, the compensated connection bracket is printed and the PCBs embedding verification is performed. The PCB can be embedded steadily, which indicates that the established model has higher precision.