Open AccessThermal simulation and cooling load analysis in the apartment unit through building construction elevation review
Author(s) -
Bambang Iskandriawan,
Ahmat Safaat
Publication year - 2019
Publication title -
iop conference series. materials science and engineering
Language(s) - English
Resource type - Journals
eISSN - 1757-899X
pISSN - 1757-8981
DOI - 10.1088/1757-899x/673/1/012113
Subject(s) - cooling load , air conditioning , apartment , elevation (ballistics) , airflow , passive cooling , air cooling , thermal , environmental science , architectural engineering , unit (ring theory) , thermal comfort , meteorology , computer science , simulation , engineering , mechanical engineering , civil engineering , structural engineering , mathematics , geography , mathematics education