Open AccessInvestigation on Optimization of Baking in Sole Bonding Process
Author(s) -
Dyi Cheng Chen,
Hua Jin,
Jhang Zong Su
Publication year - 2019
Publication title -
iop conference series. materials science and engineering
Language(s) - English
Resource type - Journals
eISSN - 1757-899X
pISSN - 1757-8981
DOI - 10.1088/1757-899x/644/1/012002
Subject(s) - process (computing) , mechanical engineering , process engineering , triz , work (physics) , engineering drawing , power (physics) , computer science , manufacturing engineering , materials science , engineering , operating system , physics , quantum mechanics