Open AccessTemperature simulation of system-in-package produced with hybrid chip mounting technology
Author(s) -
П. П. Борисков,
N. Yu. Ershova,
Vadim Putrolaynen,
Maxim Savitskii,
Pavel Seredov,
Alexei Soloviev
Publication year - 2019
Publication title -
iop conference series. materials science and engineering
Language(s) - English
Resource type - Journals
eISSN - 1757-899X
pISSN - 1757-8981
DOI - 10.1088/1757-899x/630/1/012013
Subject(s) - radiator (engine cooling) , heat sink , chip , flip chip , mold , quad flat no leads package , wire bonding , system in package , mechanical engineering , integrated circuit packaging , finite element method , materials science , integrated circuit , computer science , electronic engineering , engineering , layer (electronics) , electrical engineering , optoelectronics , structural engineering , composite material , adhesive