
MSAM2019 Preface
Publication year - 2019
Publication title -
iop conference series. materials science and engineering
Language(s) - English
Resource type - Journals
eISSN - 1757-899X
pISSN - 1757-8981
DOI - 10.1088/1757-899x/629/1/011001
Subject(s) - library science , engineering , computer science , engineering ethics
The 2nd International Conference on Material Strength and Applied Mechanics (MSAM 2019) was held from May 27-30, 2019 in Kiev, capital of Ukraine. Sponsored by Pisarenko Institute for Problems of Strength, National Academy of Sciences of Ukraine, MSAM 2019 represented a broad forum for all aspects of material strength to promote our fundamental understanding of material strength under different conditions. MSAM 2019 also provided an opportunity to present and discuss recent analytical, experimental and computational results in the field of Applied Mechanics to bridge the gap between physical theory and its application to technology. The conference had parallel sessions with dedicated selected subjects related to Material Strength and Applied Mechanics. The technical program consisted of 4 international keynote speakers, 68 oral presentations, and 18 poster presentations. The present issue of IOP Conference Series: Materials Science and Engineering (MSE) records the proceedings of MSAM2019 and contains 38 specially selected manuscripts submitted to the MSAM2019 conference. The electronic submission and handling of manuscripts via the conference website, including the selection of reviewers and evaluation of manuscripts, were identical to the procedures applied to manuscripts submitted as regular contributions for international per-reviewed publications. The organization of this conference and the preparation of proceedings volume would have been impossible without the tremendous efforts and dedication of many individuals, especially from Ms. Li Chen, who oversaw the organization of the conference and the program, and a large team of reviewers with their timely submission of quality reports. We express our sincere thanks to all authors and presenters for their contributions. We also thank very much our sponsors for their generous support. Prof. Nao-Aki Noda Technical Program Committee Chair MSAM2019 Kyushu Institute of Technology Kitakyushu, Japan, July 2019