Open AccessInvestigation the effectiveness of using heat pipe on the temperature uniformity distribution over the SC equipment panel
Author(s) -
M. Modather M. Abdou,
Aly M. Elzahaby,
Mostafa Khalil
Publication year - 2019
Publication title -
iop conference series. materials science and engineering
Language(s) - English
Resource type - Journals
eISSN - 1757-899X
pISSN - 1757-8981
DOI - 10.1088/1757-899x/610/1/012090
Subject(s) - radiator (engine cooling) , heat pipe , parametric statistics , spacecraft , mechanical engineering , thermal , loop heat pipe , reliability (semiconductor) , materials science , heat transfer , engineering , nuclear engineering , mechanics , thermodynamics , aerospace engineering , physics , power (physics) , statistics , mathematics
The heat pipe is a thermal device which allows an efficient transport of thermal energy. In this paper parametric study has been achieved to investigate the importance of using heat pipes about the uniformity of the temperature distribution over the equipment panel of the spacecraft (SC), which is a part of a real thermal control subsystem. Heat pipe analytical solution is used as a guide for design and geometrical parameters selection. The design of SC equipment panel radiator and a parametric study of the heat pipe are obtained numerically using Thermal desk top program (TDT). The space environment and the spacecraft operational conditions have been simulated by TDT program. Heat pipe prevents the hot spots which can be occurred due to the different equipment heat dissipation. The selected heat pipe design approach incorporates a conservative reliability philosophy and provides maximum operational flexibility.