Open AccessResearch on Heat Sissipation System Based on High Power LED-UV Curing Equipment
Author(s) -
Haichao Li,
Jinyao Li,
Xu Jingxiang,
Mingming Zhang,
Cai Ji-fei,
Gui-Shan Zhang
Publication year - 2019
Publication title -
iop conference series. materials science and engineering
Language(s) - English
Resource type - Journals
eISSN - 1757-899X
pISSN - 1757-8981
DOI - 10.1088/1757-899x/565/1/012016
Subject(s) - curing (chemistry) , materials science , uv curing , power consumption , composite material , thermodynamics , power (physics) , physics
LED-UV printing curing system is a new green printing curing technology for curing UV ink. Compared with the traditional UV curing device UV-LED curing device, the light source can be stabilized and ready to use without preheating, and the energy consumption is lower. It does not produce ozone and voc, and it is a green curing method. However, since a part of the energy of the LED chip is lost in the form of heat, the temperature of the PN junction is increased to lower the service life and light decay. The heat sink model was established by Solid Works and simulated analysis was performed using Fluent. A heat dissipation system for high-power LED-UV curing device was designed based on the simulation results.