Open AccessThe Research of Reliability of CX-1B-5 Connectors Coupling in AIT process of spacecraft
Author(s) -
Wei Zhang,
Dongmei Wang,
Peirong Zhao,
Xilong Xie,
Na Zuo
Publication year - 2019
Publication title -
iop conference series. materials science and engineering
Language(s) - English
Resource type - Journals
eISSN - 1757-899X
pISSN - 1757-8981
DOI - 10.1088/1757-899x/563/3/032027
Subject(s) - joint (building) , bending , structural engineering , soldering , spacecraft , reliability (semiconductor) , fracture (geology) , breakage , coupling (piping) , materials science , composite material , engineering , aerospace engineering , power (physics) , physics , quantum mechanics
This paper reviews the applications of CX-1B-5 connectors in assembly and integration process of spacecraft. Wire breakage near the solder joint is the common phenomenon of the connection failure, through fracture morphology and fault tree analysis, tensile force after repeated bending which is a key factor leads to the fatigue fracture. Because the bending of the wire at the root of the solder joint is unavoidable, wire insulation thickening method and anti-wicking tools are used to improve the reliability of CX-1B-5 connectors coupling, with the test showing the bending fatigue resistance improved by 110% by using anti-wicking tools.