
2019 International Conference on Advanced Electronic Materials, Computers and Materials Engineering (AEMCME 2019)
Publication year - 2019
Publication title -
iop conference series. materials science and engineering
Language(s) - English
Resource type - Journals
eISSN - 1757-899X
pISSN - 1757-8981
DOI - 10.1088/1757-899x/563/1/011001
Subject(s) - china , library science , field (mathematics) , engineering ethics , computer science , engineering , engineering management , political science , mathematics , pure mathematics , law
Preface This issue of Proceedings gathers the papers presented at 2019 2nd International Conference on Advanced Electronic Materials, Computers and Materials Engineering (AEMCME 2019) held on April 19-21, 2019 in Changsha, China. AEMCME is an international conference covering research and development in the field of advanced electronic materials and computers and allow the participation from all over the world. More than 500 papers were submitted on the conference, and AEMCME finally accepted 316 papers after a double blinded peer review process by international reviewers and technical program committee members. Divided into 4 chapters, the papers provide a wide spectrum of researches on wide range of advanced electronic materials and computers. The chapters are devoted to Materials Engineering, Mechanical Engineering, Computer Programming and Industrial Design, as well as Software Engineering and Algorithm. Specific research results by conference participants were presented and examined in the light of the frameworks outlined above, which is of interest to academics, researchers and professionals in this field. Three keynote speeches were presented from Prof. Zhiqiang Hou, Xi’an University of Posts and Telecommunications, China; Prof. Zhezhao Zeng, Changsha University of Science & Technology, China separately. All the talks were very impressive for the high level of professionalism, and in many cases original ideas and activities have been accomplished or proposed. List of Conference Chairs and Conference Technical Committees are available in this pdf.