Open AccessThe Influence of Mold Material on Cooling Curve, Solidification Parameters, and Micro-hardness of Al–6wt.%Si in Unidirectional Solidification
Author(s) -
Dedy Masnur,
Suyitno Suyitno,
Viktor Malau
Publication year - 2019
Publication title -
iop conference series. materials science and engineering
Language(s) - English
Resource type - Journals
eISSN - 1757-899X
pISSN - 1757-8981
DOI - 10.1088/1757-899x/547/1/012014
Subject(s) - materials science , mold , cooling curve , thermal conductivity , metallurgy , composite material , exponent , linguistics , philosophy
The influence of mold material on cooling curve, solidification parameters, and micro-hardness were investigated. Al–6wt.% Si in clay and stainless steel mold was directionally solidified using vertical Bridgman type furnace. The samples were heated up to 700°C at 1.9°C/s heat rate, held for 60 minutes, cooled, and withdrawn at 40 µm/s. The results show that the increasing of thermal conductivity by 72% affects cooling curve shape, solidification parameters, and micro-hardness. Furthermore, comparative evaluation of the exponent value of the function of micro-hardness to distance and micro-hardness to growth rate also have been made to proposed the range of exponent value for each mold material.