Open AccessOptimization of Semiconductor Device Packaging Singulation Process
Author(s) -
Tianqi Wei,
Mohd Nazri Mahmud
Publication year - 2019
Publication title -
iop conference series. materials science and engineering
Language(s) - English
Resource type - Journals
eISSN - 1757-899X
pISSN - 1757-8981
DOI - 10.1088/1757-899x/530/1/012020
Subject(s) - blade (archaeology) , materials science , sharpening , semiconductor device fabrication , silicon carbide , process optimization , mechanical engineering , process (computing) , semiconductor , engineering , composite material , nanotechnology , computer science , wafer , optoelectronics , environmental engineering , operating system
With the advancement of semiconductor technology, the assembly process of semiconductor packaging is driving the devices to become smaller and smaller in size. One of the critical processes in backend assembly is the product’s singulation to separate bulk processed products into individual unit. Before the sawing process kick-off, saw blade preparation (blade dressing) has to be performed. Blade dressing is the process of sharpening the saw blade surface to expose the diamond grits to the blade surface that are covered by the blade bonding material (Nickel-based). Inappropriate blade preparation technique induces burn mark defect to semiconductor devices. This research presented the dressing process optimization on critical factors using Silicon carbide (SiC) as part of the effort to enhance the product quality. The 2 k Full Factorial Design of Experiment (DOE) methodology, with consideration of three factors namely Blade Revolution Per Minute (RPM), Feedspeed and Dress Pass. The overall singulation process yields performance improvement by reducing the burn mark to < 0.1% with optimum saw blade preparation technique. Besides, the optimized process complementarily contributes to less kerf deformation and dressing wear.