Open AccessMicro-scratching tests of a lead-free solder alloy SAC 305 used in electronic industry
Author(s) -
Adrian Petrescu,
Nicolae Stoica,
Anca Tudor,
Alexandru Valentin Rădulescu,
Marilena Stoica,
Georgiana Chișiu
Publication year - 2019
Publication title -
iop conference series. materials science and engineering
Language(s) - English
Resource type - Journals
eISSN - 1757-899X
pISSN - 1757-8981
DOI - 10.1088/1757-899x/514/1/012015
Subject(s) - soldering , printed circuit board , alloy , materials science , scratch , electronics , lead (geology) , tribology , electronic product , dip soldering , electronic packaging , electronic component , scratching , wave soldering , mechanical engineering , metallurgy , composite material , electrical engineering , engineering , geomorphology , geology
The electronic connections need to satisfy three functionalities and those are the electrical, thermal and mechanical functionalities. The PCB (Printed Circuit Board) has the role of providing a mechanical support for an assembly of various electrical and electronical components and to connect them to obtain a functional end-product. The goal of the present paper was to identify the mechanical and tribological properties of the lead-free soldering alloy SAC 305 deposit on the copper-PCB assembly used in electronic technology. The variation of the friction coefficient for all the normal forces applied on the test samples was analyzed. The understanding of the behavior of the lead-free soldering alloy for the micro scratch test is essential for the improvement of the hole electronic system integrity.