Open AccessWi-Fi Enabled Modular Sensing System For Smart Home Applications
Author(s) -
Dar Hung Chiam,
Kay Li Ng,
King Hann Lim,
Ke San Yam
Publication year - 2019
Publication title -
iop conference series. materials science and engineering
Language(s) - Uncategorized
Resource type - Journals
eISSN - 1757-899X
pISSN - 1757-8981
DOI - 10.1088/1757-899x/495/1/012019
Subject(s) - home automation , modular design , plug and play , usb , flexibility (engineering) , computer science , embedded system , interface (matter) , the internet , host (biology) , universal plug and play , computer network , telecommunications , operating system , ecology , statistics , mathematics , software , bubble , maximum bubble pressure method , biology