Open AccessEffect of microcapsule layout on crack repair
Author(s) -
Mingming Fu,
Ting Wang
Publication year - 2019
Publication title -
iop conference series. materials science and engineering
Language(s) - English
Resource type - Journals
eISSN - 1757-899X
pISSN - 1757-8981
DOI - 10.1088/1757-899x/493/1/012088
Subject(s) - materials science , compressive strength , composite material , fracture mechanics , residual strength , curing (chemistry) , compression (physics) , crack closure , structural engineering , engineering