Open AccessLightweight thermal insulation composites with redispersible polymer powder addition
Author(s) -
Tongwei Liu,
Guopu Shi,
Guozhong Li,
Zhi Wang
Publication year - 2019
Publication title -
iop conference series. materials science and engineering
Language(s) - Uncategorized
Resource type - Journals
eISSN - 1757-899X
pISSN - 1757-8981
DOI - 10.1088/1757-899x/490/2/022066
Subject(s) - materials science , composite material , thermal conductivity , thermal insulation , polymer , flexural strength , compressive strength , thermal , thermal resistance , layer (electronics) , physics , meteorology