Open AccessExperimental Study of Laminar Cooling Process on Temperature Field of the Heavy Plate
Author(s) -
Wenhong Liu,
Siyu Zhang,
Junlin Wang
Publication year - 2018
Publication title -
iop conference series. materials science and engineering
Language(s) - English
Resource type - Journals
eISSN - 1757-899X
pISSN - 1757-8981
DOI - 10.1088/1757-899x/452/2/022034
Subject(s) - laminar flow , heat transfer , materials science , heat transfer coefficient , process (computing) , mechanics , thermodynamics , field (mathematics) , computer science , physics , mathematics , operating system , pure mathematics