Open AccessThe Formation of Nano Compounds during Sn/Cu Wetting
Author(s) -
Shaorong Li,
Yao Yang,
Yuxin Liang,
Bangsheng Li
Publication year - 2018
Publication title -
iop conference series. materials science and engineering
Language(s) - English
Resource type - Journals
eISSN - 1757-899X
pISSN - 1757-8981
DOI - 10.1088/1757-899x/452/2/022020
Subject(s) - wetting , whisker , intermetallic , materials science , soldering , nano , tin , copper , composite material , substrate (aquarium) , metallurgy , wetting layer , chemical engineering , alloy , oceanography , engineering , geology