Open AccessElectrical conductivity and strength of ultrafine-grained copper containing deformation vacancies, alloying atoms and dislocations
Author(s) -
R. G. Chembarisova
Publication year - 2018
Publication title -
iop conference series. materials science and engineering
Language(s) - English
Resource type - Journals
eISSN - 1757-899X
pISSN - 1757-8981
DOI - 10.1088/1757-899x/447/1/012085
Subject(s) - materials science , electrical resistivity and conductivity , copper , impurity , condensed matter physics , alloy , scattering , lattice (music) , electron , crystallographic defect , metallurgy , chemistry , physics , organic chemistry , optics , quantum mechanics , acoustics , electrical engineering , engineering