Open AccessStudy on the Cauer Thermal Network Model of Press Pack IGBTs
Author(s) -
Jingyuan Li,
Zhongyuan Chen,
Shouwen Liu,
Erping Deng,
Zhibin Zhao
Publication year - 2018
Publication title -
iop conference series materials science and engineering
Language(s) - English
Resource type - Journals
eISSN - 1757-899X
pISSN - 1757-8981
DOI - 10.1088/1757-899x/439/5/052012
Subject(s) - insulated gate bipolar transistor , thermal resistance , thermal , finite element method , materials science , clamping , voltage , reliability (semiconductor) , electrical engineering , power (physics) , mechanics , mechanical engineering , electronic engineering , engineering , physics , structural engineering , thermodynamics
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