Open AccessStress analysis of cylindrical parts during deep drawing based on Dynaform
Author(s) -
Dong Yang Wu,
Qichao Wang,
Xiaoming Wang,
Bin Wang
Publication year - 2018
Publication title -
iop conference series. materials science and engineering
Language(s) - English
Resource type - Journals
eISSN - 1757-899X
pISSN - 1757-8981
DOI - 10.1088/1757-899x/423/1/012166
Subject(s) - blank , deep drawing , stress (linguistics) , mold , die (integrated circuit) , process (computing) , stress–strain curve , cone (formal languages) , materials science , structural engineering , mechanical engineering , composite material , engineering , computer science , deformation (meteorology) , philosophy , linguistics , algorithm , operating system