Open AccessA Co-Simulation Analysis Method for Improving PCB EMC Performance
Author(s) -
Luchen Huang,
Hui Huang,
Yaru Dong
Publication year - 2018
Publication title -
iop conference series. materials science and engineering
Language(s) - English
Resource type - Journals
eISSN - 1757-899X
pISSN - 1757-8981
DOI - 10.1088/1757-899x/394/4/042114
Subject(s) - electromagnetic compatibility , power (physics) , printed circuit board , electronic engineering , field (mathematics) , engineering , computer science , automotive engineering , electrical engineering , mathematics , physics , quantum mechanics , pure mathematics