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Heat distribution in the deep drawing device components working by high temperatures
Author(s) -
Michal Tropp,
František Brumerčík,
Ján Šteininger,
Peter Weis,
Adam Głowacz
Publication year - 2018
Publication title -
iop conference series. materials science and engineering
Language(s) - English
Resource type - Journals
eISSN - 1757-899X
pISSN - 1757-8981
DOI - 10.1088/1757-899x/393/1/012075
Subject(s) - transient (computer programming) , materials science , crystallization , mechanical engineering , thermal , computer simulation , mechanics , computer science , thermodynamics , simulation , engineering , physics , operating system

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