Open AccessDevelopment of A Thermal Expansion Crack Agent
Author(s) -
Weiwei Yang,
Jiping Liu,
Ying Liu,
Xiaobo Liu,
Junyi Du,
Han Jia
Publication year - 2018
Publication title -
iop conference series. materials science and engineering
Language(s) - English
Resource type - Journals
eISSN - 1757-899X
pISSN - 1757-8981
DOI - 10.1088/1757-899x/392/3/032025
Subject(s) - thermal expansion , materials science , composite material