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Effect of Hot Extrusion through Mathematically Contoured Die on Mechanical and Tribological Characteristics of the AMC Prepared through P/M Route
Author(s) -
Subhashree Mohapatra,
Kalipada Maity,
Sataya Brata Ghadei,
Akhtar Khan
Publication year - 2018
Publication title -
iop conference series. materials science and engineering
Language(s) - English
Resource type - Journals
eISSN - 1757-899X
pISSN - 1757-8981
DOI - 10.1088/1757-899x/390/1/012008
Subject(s) - extrusion , tribology , die (integrated circuit) , materials science , composite material , engineering drawing , metallurgy , mechanical engineering , engineering , nanotechnology

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