Open AccessEffect of Copper Ion Concentration on Microstructure and Mechanical Properties of Electrolytic Copper Foil
Author(s) -
Yanfeng Li,
Guojie Huang,
Xiang Yin,
Xi Chen,
Xiang Ma,
Yongzhen Li,
Endong Yao
Publication year - 2018
Publication title -
iop conference series. materials science and engineering
Language(s) - English
Resource type - Journals
eISSN - 1757-899X
pISSN - 1757-8981
DOI - 10.1088/1757-899x/381/1/012166
Subject(s) - copper , materials science , foil method , electrolyte , copper plating , metallurgy , microstructure , current density , texture (cosmology) , electrode , composite material , chemistry , electroplating , layer (electronics) , physics , image (mathematics) , quantum mechanics , artificial intelligence , computer science