Open AccessMicro-grooving of silicon wafer by Nd:YAG laser beam machining
Author(s) -
Tashi Dolma Sherpa,
B. B. Pradhan
Publication year - 2018
Publication title -
iop conference series. materials science and engineering
Language(s) - English
Resource type - Journals
eISSN - 1757-899X
pISSN - 1757-8981
DOI - 10.1088/1757-899x/377/1/012219
Subject(s) - machining , surface micromachining , wafer , materials science , laser , laser beam machining , ceramic , silicon , surface roughness , surface finish , optoelectronics , semiconductor , laser beams , diode , optics , mechanical engineering , metallurgy , composite material , engineering , fabrication , medicine , alternative medicine , physics , pathology