Open AccessEffects of copper content in Sn-based solder on the intermetallic phase formation and growth during soldering
Author(s) -
Niwat Mookam,
Phacharaphon Tunthawiroon,
Kannachai Kanlayasiri
Publication year - 2018
Publication title -
iop conference series. materials science and engineering
Language(s) - English
Resource type - Journals
eISSN - 1757-899X
pISSN - 1757-8981
DOI - 10.1088/1757-899x/361/1/012008
Subject(s) - soldering , intermetallic , materials science , metallurgy , copper , substrate (aquarium) , phase (matter) , diffusion , chemistry , thermodynamics , organic chemistry , alloy , geology , oceanography , physics