Open AccessMechanical Properties of Oxide Films on Electrolytic In-process Dressing (ELID) Copper-based Grinding Wheel
Author(s) -
Ji Cai Kuai,
Jilun Wang,
ChengRan Jiang,
H L Zhang,
Zhibo Yang
Publication year - 2018
Publication title -
iop conference series. materials science and engineering
Language(s) - English
Resource type - Journals
eISSN - 1757-899X
pISSN - 1757-8981
DOI - 10.1088/1757-899x/359/1/012013
Subject(s) - nanoindentation , materials science , oxide , grinding wheel , copper , grinding , elastic modulus , composite material , creep , modulus , copper oxide , metallurgy , matrix (chemical analysis)