Open AccessSolidification and Microstructure of Ni-Containing Al-Si-Cu Alloy
Author(s) -
Fang Li,
Luyang Ren,
Xinyu Geng,
Henry Hu,
Xueyuan Nie,
Jimi Tjong
Publication year - 2018
Publication title -
iop conference series. materials science and engineering
Language(s) - English
Resource type - Journals
eISSN - 1757-899X
pISSN - 1757-8981
DOI - 10.1088/1757-899x/301/1/012002
Subject(s) - eutectic system , materials science , alloy , intermetallic , microstructure , nucleation , metallurgy , cooling curve , scanning electron microscope , energy dispersive x ray spectroscopy , phase (matter) , nickel , aluminium , composite material , thermodynamics , chemistry , physics , organic chemistry