Open AccessFirst principles study of Ti5Si3 intermetallic compounds with Cu additions: Elastic properties and electronic structure
Author(s) -
P F Zhang,
Y X Li,
Peikang Bai
Publication year - 2018
Publication title -
iop conference series. materials science and engineering
Language(s) - English
Resource type - Journals
eISSN - 1757-899X
pISSN - 1757-8981
DOI - 10.1088/1757-899x/284/1/012013
Subject(s) - intermetallic , bulk modulus , materials science , lattice constant , shear modulus , ductility (earth science) , elastic modulus , cauchy distribution , density functional theory , electronic structure , coordination number , thermodynamics , poisson's ratio , atomic number , structural stability , young's modulus , poisson distribution , computational chemistry , composite material , atomic physics , chemistry , physics , alloy , organic chemistry , structural engineering , diffraction , optics , engineering , ion , creep , statistics , mathematics