Open AccessCoupled Temperature Displacement Model to Predict Residual Stresses in Milling Process
Author(s) -
M Pramod,
Narahari Varun Reddy,
Viswajit Talluru,
Yarkareddy Gopi Reddy,
K. Marimuthu
Publication year - 2017
Publication title -
iop conference series. materials science and engineering
Language(s) - Uncategorized
Resource type - Journals
eISSN - 1757-899X
pISSN - 1757-8981
DOI - 10.1088/1757-899x/225/1/012026
Subject(s) - residual stress , materials science , finite element method , machining , von mises yield criterion , work (physics) , displacement (psychology) , ultimate tensile strength , structural engineering , composite material , stress (linguistics) , residual , deformation (meteorology) , mechanical engineering , metallurgy , engineering , computer science , psychology , algorithm , psychotherapist , linguistics , philosophy