Open AccessCorrelating the synthesis protocol of aromatic polyimide film with the properties of polyamic acid precursor
Author(s) -
Peng Chee Tan,
Boon Seng Ooi,
A.L. Ahmad,
Siew Chun Low
Publication year - 2017
Publication title -
iop conference series. materials science and engineering
Language(s) - English
Resource type - Journals
eISSN - 1757-899X
pISSN - 1757-8981
DOI - 10.1088/1757-899x/206/1/012049
Subject(s) - polyimide , materials science , casting , rheology , solubility , viscosity , polymer chemistry , polymer , chemical engineering , tape casting , composite material , organic chemistry , chemistry , layer (electronics) , slurry , engineering
Thousands of different copolyimide combinations render it technically impossible to have a single universal synthesis method to produce aromatic polyimide film. This study aimed to outline the selection of synthesis protocol, either through the casting of chemically imidized polyimide solution or thermal imidization of polyamic acid (PAA), to produce the polyimide film. The rheological behaviour, molecular weight, and solubility of five structurally different PAA were analysed and correlated to both imidization methods. In this work, a tough polyimide film was successfully synthesized by casting the chemically imidized polyimide derived from high viscosity (> 81 cP) and high molecular weight (≥ 1.35 x 10 6 g/mol) PAA. On the contrary, both low viscosity ( 81 cP) PAA demonstrated the possibility to produce polyimide film via thermal imidization route. The longer molecular chain of ODPA-6FpDA:DABA (3:2) polyimide produced from thermal imidization had restricted the passage of CO 2 across the polyimide film when it was applied in the gas separation application. The outcome from this work serves as a guideline for the selection of suitable polyimide film synthesis protocol, which will minimize the time and chemical consumption in future exploration of new polyimide structure.