Open AccessModelling and Optimization of Copper Electroplating Adhesion Strength
Author(s) -
Suryanto Suryanto,
Farag I. Haider,
Mohd Hanafi Ani,
Mahmood Hameed Mahmood
Publication year - 2017
Publication title -
iop conference series. materials science and engineering
Language(s) - English
Resource type - Journals
eISSN - 1757-899X
pISSN - 1757-8981
DOI - 10.1088/1757-899x/204/1/012017
Subject(s) - electroplating , copper , adhesion , materials science , scanning electron microscope , substrate (aquarium) , response surface methodology , austenitic stainless steel , metallurgy , composite material , current density , corrosion , layer (electronics) , chemistry , chromatography , oceanography , physics , quantum mechanics , geology