
Finite element analysis of chip formation usingale method
Author(s) -
V. Jayaprakash
Publication year - 2017
Publication title -
iop conference series. materials science and engineering
Language(s) - Uncategorized
Resource type - Journals
eISSN - 1757-899X
pISSN - 1757-8981
DOI - 10.1088/1757-899x/197/1/012049
Subject(s) - residual stress , finite element method , machining , isotropy , work (physics) , stress (linguistics) , distortion (music) , structural engineering , process (computing) , mechanical engineering , materials science , computer science , engineering , composite material , amplifier , linguistics , philosophy , physics , optoelectronics , cmos , quantum mechanics , operating system