Open AccessModal testing circuit board assembly of an electronic apparatus by laser vibrometry
Author(s) -
В. А. Красновейкин,
I. Yu. Smolin,
N. V. Druzhinin,
Е. А. Колубаев,
D. A. Derusova
Publication year - 2016
Publication title -
iop conference series. materials science and engineering
Language(s) - English
Resource type - Journals
eISSN - 1757-899X
pISSN - 1757-8981
DOI - 10.1088/1757-899x/156/1/012005
Subject(s) - vibration , acoustics , printed circuit board , chirp , modal , signal (programming language) , displacement (psychology) , modal analysis , engineering , laser , materials science , computer science , electrical engineering , optics , physics , psychology , polymer chemistry , psychotherapist , programming language
The operating capacity and service life of printed circuit boards in various electronic equipment and devices depends on their ability to resist vibroacoustic loads, including vibration and acoustic noises. In this paper, non-contact laser vibrometry has been applied to perform the modal analysis of a circuit board assembly in order to identify its vulnerable spots and to find solutions to protect the assembly from external vibroacoustic loads. A broadband periodic chirp signal was used to excite vibration, which enabled a rapid generation of results. The paper provides data on eigenfrequencies, vibration velocity fields, and vibration displacement profiles. Frequency ranges have been determined in which eigenfrequencies with the highest vibration amplification lie. The obtained data can be used to develop a quality control technique for printed circuit boards and to optimize their construction as early as the design stage